Thermophysical Properties of W–Re Alloys Above the Melting Region

In earlier experiments we have studied pure elements with a fast pulse heating technique to obtain thermophysical properties of the liquid state. We report here results for thermophysical properties such as specific heat and dependences among enthalpy, electrical resistivity, and temperature, for four W–Re alloys (3.95, 21.03, 23.84, and 30.82 at % of Re) in a wide temperature range covering solid and liquid states. Thermal conductivity is calculated using the Wiedemann–Franz law for the liquid alloy, as.well as data for thermal diffusivity for the beginning of the liquid phase. Additionally, data for the entire temperature range studied have been analyzed in comparison with those of the constituent elements, tungsten and rhenium, since both metals have been studied previously with the same experimental technique. Such information is of interest in the field of metallurgy since W–Re alloys of low Re content in the region of mutual component solubility in the solid state are widely used as thermocouple materials for the purposes of high-temperature thermometry.     

A new microsecond pulse-heating system to investigate thermophysical properties of solid and liquid metals

A new discharge system for resistive self-heating has been constructed for the measurement of accurate thermophysical properties. A constant-current pulse is used to heat metals over a time interval of 50 to 100 s, reaching temperatures up to the boiling point. New techniques have been developed to obtain sound speeds in the pulse-heated sample, emissivities, and vapor pressure. A new pyrometer allows the extension of the measured temperature range down to the melting point of copper.     

As离子注入形成硅化钨的研究

大规模集成电路的发展使集成度不断提高,器件尺寸减小,线条变窄。现常用的多晶硅栅和互连,由于电阻率高,限制了集成电路的速度。近年发展起来的硅化物材料,因其电阻率低、稳定性好、自对准性能好而常被用作大规模集成电路中的欧姆接触,互连和肖特基势垒。     

Thermal accommodation coefficient of gases on controlled solid surfaces: Argon-tungsten system

The knowledge of the thermal accommodation coefficient for gases on well-controlled surfaces as a function of temperature is imperative to understanding the mechanism of interphase heat transfer on the microscopic level. With this goal in view, a heat transfer column instrument is designed, fabricated, assembled, and tested for the specific case a argon—tungsten system. With 99.9999%, pure argon, six sets of data are taken in the rarefied gas region in the maximum temperature range of 500–1500 K. Four sets of these measurements are in the temperature-jump region and are analyzed by the constant-power method to compute the thermal accommodation coefficient of argon on a controlled tungsten surface. The other two sets are taken under free-molecular flow conditions and are interpreted in accordance with the man-free-path kinetic theory for the low-pressure regime. These data are compared and discussed in the context of reported data in the literature and interpreted in the light of the surface condition and finish of the tungsten wire.Nomenclature A area of the solid surface - C _j constants in Eq. (3); j=0, 1, 2, 3, and 4 - E _i incident energy flux - E _r reflected energy flux - E _s reflected energy flux when the interaction between the gas and the solid atoms is complete - g temperature-jump distance - L half-length of the metal wire - M molecular weight of the gas - P gas pressure - Q _H total thermal energy conducted by the gas per unit time from the hot surface - Q_KT total thermal energy conducted by the gas per unit time if the striking gas molecules were to attain thermal equilibrium with the hot surface - R molar gas constant - r radial coordinate - r _f radius of the hot wire - S sticking coefficient - S_o initial sticking coefficient - T temperature - T _e linearly extrapolated gas temperature on the hot-wire surface - T _g temperature of the impinging gas molecules - T _H temperature of the hot surface - T _i temperature of the incident gas stream - T _r temperature of the gas molecules receding after collision with the solid surface - T _s temperature of the solid surface Greek Symbols thermal accommodation coefficient for the gas—solid surface - resistivity of the metal wire - gas coverage on the solid surface For an explanation of symbols, see Nomenclature.     

THERMAL DEBINDING OF A NEW BINDER

ＴＨＥＲＭＡＬＤＥＢＩＮＤＩＮＧＯＦＡＮＥＷＢＩＮＤＥＲ①ＺｈｏｕＪｉｃｈｅｎｇ，ＨｕａｎｇＢａｉｙｕｎ，ＷｕＥｎｘｉ，ＹｕＬｉｇｏｎｇ，ＱｕＸｕａｎｈｕｉＮａｔｉｏｎａｌＫｅｙＬａｂｏｒａｔｏｒｙｆｏｒＰｏｗｄｅｒＭｅｔａｌｕｒｇｙ，Ｃｅｎｔｒａ...     

高纯钨中杂质元素的化学光谱法测定

采用以一定比例的ＨＮＯ３和ＨＣｌ为介质，使钨沉淀成钨酸与杂质分离，然后用碳粉吸附杂质再进行光谱测定的方法，对高纯钨（包括金属钨、三氧化钨、钨酸、钨酸铵）中１５个杂质元素Ｆｅ、Ｎｉ、Ｃｕ、Ｍｎ、Ａｌ、Ｖ、Ｃｒ、Ｃｏ、Ｃａ、Ｍｓ、Ｐｂ、Ｓｎ、Ｂｉ、Ｃｄ、Ｂｅ进行了测定，取得了理想的结果，测定下限可达（０．１～０．５）×１０（－６）。     

燃烧合成三元碳化合物Ti2AlC1-x

采用Ti，Al和C元素粉末为反应物原料，通过燃烧合成法首次成功地制备出了单相三元碳化合物Ti2AlC1-x。实验结果表明：若以“理想”晶体结构化学式Ti2AlC化学计量比为起始反应原料配比，燃烧产物主晶相为Ti2AlC2；以缺碳的非化学计量比(Ti2AlC1-x)为反应原料配比，即Ti：Al：C=3：1．5：1=2：1：0．7(摩尔比)，得到单相的燃烧产物Ti2AlC1-x。从热力学原理的角度探讨了不同原料摩尔配比对燃烧产物相组成的影响机理。     

钨酸铵溶液浓度对超微钨粉形貌的影响

以钨酸铵溶液为原料，采用超声喷雾干燥法制备了超微钨粉。研究了该方法中钨酸铵浓度对超微钨粉形貌的影响。结果表明，当溶液中钨酸铵的浓度为10%时，得到了球形度很好的非完全结晶的前驱体。当钨酸铵浓度达25％时，得到了层片状的晶态前驱体。钨酸铵溶液浓度对干燥时晶体生长速度具有重要的影响。分别采用这2种前驱体在630℃，保温30min和氢气流莆4L／min条仲下能够完全还原，得到超微α—W粉。所制得的钨粉形貌完全遗传了其前驱体的形貌，分别得到球状和层状钨粉。球状钨粉由纳米颗粒聚集而成。片层状钨粉的厚度在1mm以下。     

长期高温服役的12%Cr耐热合金钢性能退化与恢复

X2 0CrMoV12 1耐热合金钢广泛应用于热电厂主蒸汽管线等主要部件。经长期高温负荷运行后 ,材料性能明显退化。观察显微组织发现 ,材料性能下降是和晶界碳化物的粗化密切相关的。文章着重研究了损伤材料重新热处理后的性能和组织结构的变化 ,初步探讨了材料长期服役后通过热处理恢复其原始性能的可能性     

关于硬质合金行业技改项目合同管理的思考

就硬质合金行业技改项目在实施过程开展有关合同管理的问题进行分析讨论,并提出应对措施,对搞好硬质合金行业技改项目合同管理工作具有现实意义。